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符合的藏品
共找到 82 筆符合的資料
Global-to-Local Modeling and E...
有限元素法 高功率覆晶封裝 錫球接點可靠度 疲勞壽命 Finite element method HFCBGA package Solder joint reliability Fatigue.....more
- 16/82
Parametric Assessment for Boar...
Parametric Assessment for Board-Level Solder Ball Reliability of a HFC-BGA Package 臺灣期刊論文索引系統 來源期刊:Chung Hua.....more
- 17/82
The Effect of Cerium on Solder...
國家圖書館 19990700 期刊論文 Xuan，Tianpen Zhao，Sumei Wang，Xiangtong The Effect of Cerium on Solder--Ability.....more
- 18/82
先進構裝之濕式製程與設備
錫鉛凸塊 凸塊底下之金屬層 覆晶式接合 晶圓級構裝 錫鉛助熔劑 光阻顯影 光阻去除 Solder bump Under bump metallurgy UBM Flip chip Package.....more
- 19/82
添加單壁奈米碳管對Sn-Ag銲料之...
複合銲料 單壁奈米碳管 金屬間化合物 微結構 銲點 SWCNTs IMC Composite solder Single-wall carbon nanotubes Interfacial.....more
- 20/82
A Study of Factors Affecting S...
Finite-volume-weighted averaging technique Parametric finite element analysis Solder joint reliability.....more
- 21/82
銅與銅/鎳/金導體上銲錫遷移性之...
銅/鎳/金導體 電解質遷移 錫銀銲料 錫鉛銲料 銅導體 Electrolytic migration Sn-Ag solder Sn-Pb solder Cu-conductors Cu/Ni/Au.....more
- 22/82
Effects of Printed Circuit Boa...
Lead free solder Sn-Ag-Cu Surface finish Ni/Au Organic solderability preservative Lead back side.....more
- 23/82
溫度循環作用下負載形式、黏塑性...
solder Copper core solder 國家圖書館 20031200 期刊論文 陳榮盛(Chen， R. S.) 曾穗卿(Tseng， S. C.) 葉裕德(Yeh， Y. T.) 劉景玉.....more
- 24/82
Intermetallic Reactions in a S...
-sheng Wu， Hui-min Chuang， Tung-han Intermetallic Reactions in a SN-51IN Solder BGA Package.....more
- 25/82
Deformation Kinetics of Steady...
of Steady Creep in Sn/Pb Solder Alloys with Applications 臺灣期刊論文索引系統 來源期刊:Journal of Mechanics 卷期:20:2 民93.....more
- 26/82
Mechanical Behavior of Sn-3Ag-...
Sn-3Ag-0.5Cu solder Ball-grid array assembly Tensile test behaviors Homologous temperatures.....more
- 27/82
薩克斯風創新技術發展
薩克斯風 表面處理 焊錫清潔 Saxophone Surface finishing technology Solder cleaning 國家圖書館 20070400 期刊論文 江忠鍵 粘永峰 蔡.....more
- 28/82
Failure Life Prediction and Fa...
Flip chip Factorial analysis Lead-free Pre-solder structure 國家圖書館 20070500 期刊論文 Chiu， Chien-Chia Wu.....more
- 29/82
Electric Current Effects in Fl...
， Chao-hong) 陳信文(Chen， Sinn-wen) Electric Current Effects in Flip Chip Solder Joints 臺灣期刊論文索引系統 來源期刊.....more
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