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符合的藏品
共找到 83 筆符合的資料
Solder Joint Reliability Analy...
WLCSP Solder joint reliability Cu stud Nonlinear finite element method 國家圖書館 20030700 期刊論文 Chang.....more
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錫鉛凸塊技術(Solder Bumping Te...
錫鉛凸塊技術 Solder bumping technology 國家圖書館 19980800 期刊論文 孔令臣 錫鉛凸塊技術(Solder Bumping Technology) 臺灣期刊論文索引.....more
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Damage-Coupled Viscoplastic Co...
Damage Viscoplasticity Thermomechanical fatigue Solder 國家圖書館 20041000 期刊論文 Chow，Chi Loong Wei，Yong.....more
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Cyclic Stress-Strain Behavior ...
BGA Sn/3.5Ag/0.75Cu solder joing speciment Loading-directionally aligned grip system Hysteresis.....more
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Theory of Endochronic Cyclic V...
Endochronic viscoplasticity 60Sn/40Pb Strain rate dependent intrinsic time scale Electronic solder.....more
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Modeling of Solder Fatigue Fai...
Solder joint Fatigue Ductile damage Plastic deformation Finite element analysis 國家圖書館 20101200 期刊論文.....more
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時效與應變率對Sn-Ag-Sb-Cu銲點...
Sn-Ag-Sb-Cu 無鉛銲料 IMC層 微觀組織 拉伸強度 銲點 Sn-Ag-Sb-Cu lead-free solder IMC layer Microstructure Solder.....more
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Thermodynamic Formulation of E...
Endochronic cyclic viscoplasticity with damage Eutectic Sn/Pb solder Evolution equation of cyclic.....more
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The Endochronic Viscoplasticit...
Endochronic viscoplasticity Sn/3.9Ag/0.6Cu solder Fatigue loading coupled with thermal cycling.....more
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Predicting Fatigue Initiation ...
.8Ag/0.7Cu solder Critical cyclic damage Modified Coffin-Manson relationship Fatigue initiation life 國.....more
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Endochronic Fatigue Life Predi...
Damage-coupled endochronic viscoplasticity Sn/3.5Ag/0.75Cu BGA solder joint specimen Φ angle.....more
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Chemical Reaction in Solder Jo...
Solder Surface finish Reflow Intermetallic compound Electronic package 微電子封裝 銲點 化學反應 國家圖書館 20030700.....more
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Ni粉末之添加對Sn-Ag無鉛銲料系...
無鉛銲錫 複合銲錫 微結構 微硬度 Ni粉末 Lead-free solder Composite solder Microstructure Microhsrdness Ni particle 國.....more
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Sn-xAg-0.5Cu-0.04Ni-0.01Ge無鉛...
無鉛銲料 噴錫 界面反應 介金屬化合物 咬蝕 Lead-free solder Hot air solder leveling Interfacial reaction Intermetallic.....more
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